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1

Identification and Characterization of Particulate Contaminants Found at a Data Center Using Airside Economization

Shah, Jimil M., Misrak, Abel, Agonafer, Dereje, Kaler, Mike

Journal:

Journal of Electronic Packaging

Year:

2019

Language:

english

File:

PDF, 10.47 MB

english, 2019

2

Design for Reliability Applied to Packaging of a MOEMS Switch

Fasoro, Abiodun A., Mittal, Manoj, Popa, Dan O., Agonafer, Dereje A., Stephanou, Harry E.

Journal:

Journal of Electronic Packaging

Year:

2008

Language:

english

File:

PDF, 1.18 MB

english, 2008

3

[IEEE 2012 IEEE/CPMT 28th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM) - San Jose, CA, USA (2012.03.18-2012.03.22)] 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) - CFD analysis of free cooling of modular data centers

Gebrehiwot, Betsegaw, Aurangabadkar, Kushal, Kannan, Naveen, Agonafer, Dereje, Sivanandan, Deepak, Hendrix, Mark

Year:

2012

Language:

english

File:

PDF, 578 KB

english, 2012

4

A Brief Overview of Recent Developments in Thermal Management in Data Centers

Alkharabsheh, Sami, Fernandes, John, Gebrehiwot, Betsegaw, Agonafer, Dereje, Ghose, Kanad, Ortega, Alfonso, Joshi, Yogendra, Sammakia, Bahgat

Journal:

Journal of Electronic Packaging

Year:

2015

Language:

english

File:

PDF, 3.92 MB

english, 2015

5

Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature

Bhopte, Siddharth, Agonafer, Dereje, Schmidt, Roger, Sammakia, Bahgat

Journal:

Journal of Electronic Packaging

Year:

2006

Language:

english

File:

PDF, 1.30 MB

english, 2006

6

Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application

Bhopte, Siddharth, Alshuqairi, Musa S., Agonafer, Dereje, Refai-Ahmed, Gamal

Journal:

Journal of Electronic Packaging

Year:

2004

Language:

english

File:

PDF, 974 KB

english, 2004

7

[IEEE 2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) - San Jose, CA, USA (2016.3.14-2016.3.17)] 2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) - Expanding the envelope for indirect/direct evaporative data center cooling using thermal energy storage

Luttrell, Jeff, Guhe, Abhishek, Agonafer, Dereje

Year:

2016

Language:

english

File:

PDF, 593 KB

english, 2016

8

[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Effects of mineral oil immersion cooling on IT equipment reliability and reliability enhancements to data center operations

Shah, Jimil M., Eiland, Richard, Siddarth, Ashwin, Agonafer, Dereje

Year:

2016

Language:

english

File:

PDF, 937 KB

english, 2016

9

[IEEE 2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) - San Jose, CA, USA (2017.3.13-2017.3.17)] 2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) - Effect of PCB thickness on solder joint reliability of Quad Flat no-lead assembly under Power Cycling and Thermal Cycling

Rahangdale, Unique, Srinivas, Rahul, Krishnamurthy, S., Rajmane, Pavan, Misrak, Abel, Sakib, A. R., Agonafer, Dereje, Lohia, Alok, Kummerl, Steven, Nguyen, Luu T.

Year:

2017

Language:

english

File:

PDF, 1.70 MB

english, 2017

10

Impact of TXV and Compressor in the Stability of a High-End Computer Refrigeration System

Makwana, Yasin, Agonafer, Dereje, Manole, Dan

Journal:

Journal of Electronic Packaging

Year:

2004

Language:

english

File:

PDF, 540 KB

english, 2004

11

[ASME ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems - San Francisco, California, USA (Tuesday 29 August 2017)] ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply

Rahangdale, Unique, Rajmane, Pavan, Misrak, Abel, Agonafer, Dereje

Year:

2017

Language:

english

File:

PDF, 2.37 MB

english, 2017

12

[IEEE 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - CFD Simulation and Optimization of the Cooling of Open Compute Machine Learning “Big Sur” Server

Dhadve, Mangesh, Shah, Jimil M., Agonafer, Dereje

Year:

2018

Language:

english

File:

PDF, 2.96 MB

english, 2018

13

Methodology for an Integrated (Electrical/Mechanical) Design of PWBA

Ahn, Wonkee, Agonafer, Dereje, Novotny, Shlomo

Journal:

Journal of Electronic Packaging

Year:

2004

Language:

english

File:

PDF, 350 KB

english, 2004

14

Foreword

Sammakia, Bahgat, Agonafer, Dereje

Journal:

Journal of Electronic Packaging

Year:

2004

Language:

english

File:

PDF, 47 KB

english, 2004

15

A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending

Leon Xu, Tommi Reinikainen, Wei Ren, Bo Ping Wang, Zhenxue Han, Dereje Agonafer

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 299 KB

english, 2004

16

[IEEE 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM) - Orlando, FL, USA (2008.05.28-2008.05.31)] 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - CFD modeling of a thermoelectric device for electronics cooling applications

Lakhkar, Nikhil, Hossain, Mohammad, Agonafer, Dereje

Year:

2008

Language:

english

File:

PDF, 285 KB

english, 2008

17

[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Effectiveness of rack-level containment in removing data center hot-spots

Onyiorah, Chris, Eiland, Richard, Agonafer, Dereje, Schmidt, Roger

Year:

2014

Language:

english

File:

PDF, 1.81 MB

english, 2014

18

[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Improving cooling efficiency of servers by replacing smaller chassis enclosed fans with larger rack-mount fans

Nagendran, Bharath, Nagaraj, Shreyas, Fernandes, John, Eiland, Richard, Agonafer, Dereje, Mulay, Veerendra

Year:

2014

Language:

english

File:

PDF, 2.32 MB

english, 2014

19

[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Impact of replacing Sn-Ag bumps with Cu pillars on the BEoL Cu/Low-k fracture under reflow - a computational study

Baig, Zaeem, Shetty, Tejas S., Nazmus Sakib, A R., Mirza, Fahad, Agonafer, Dereje

Year:

2014

Language:

english

File:

PDF, 728 KB

english, 2014

20

Effect of Through-Silicon-Via Joule Heating on Device Performance for Low-Powered Mobile Applications

Mirza, Fahad, Naware, Gaurang, Jain, Ankur, Agonafer, Dereje

Journal:

Journal of Electronic Packaging

Year:

2014

Language:

english

File:

PDF, 2.14 MB

english, 2014

21

[IEEE 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) - San Jose, CA, USA (2015.3.15-2015.3.19)] 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) - Steady state CFD modeling of an IT pod and its cooling system

Sathyanarayan, Suhas, Gebrehiwot, Betsegaw, Sreeram, Vishnu, Sawant, Digvijay, Agonafer, Dereje, Kannan, Naveen, Hoverson, James, Kaler, Mike

Year:

2015

Language:

english

File:

PDF, 1.32 MB

english, 2015

22

Thermoelectric Cooling Analysis Using Modified-Graphical-Method for Multidimensional-Heat-Transfer-System

Phan, Huy N., Agonafer, Dereje

Journal:

Journal of Electronic Packaging

Year:

2011

Language:

english

File:

PDF, 600 KB

english, 2011

23

Experimental Analysis Model of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric Coolers

Phan, Huy N., Agonafer, Dereje

Journal:

Journal of Electronic Packaging

Year:

2010

Language:

english

File:

PDF, 775 KB

english, 2010

24

Design Optimization and Reliability of PWB Level Electronic Package

Hossain, Mohammad Masum, Jagarkal, Sudhakar G., Agonafer, Dereje, Lulu, Menberu, Reh, Stefan

Journal:

Journal of Electronic Packaging

Year:

2007

Language:

english

File:

PDF, 890 KB

english, 2007

25

[ASME ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, California, USA (Monday 6 July 2015)] Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales - Chip Package Interaction Study to Analyze the Mechanical Integrity of a 3-D TSV Package

Rajmane, Pavan, Mirza, Fahad, Khan, Hassaan, Agonafer, Dereje

Year:

2015

Language:

english

File:

PDF, 2.57 MB

english, 2015

26

Development of Analytical Model to a Temperature Distribution of a First Level Package With a Nonuniformly Powered Die

Kaisare, Abhijit, Agonafer, Dereje, Haji-Sheikh, A., Chrysler, Greg, Mahajan, Ravi

Journal:

Journal of Electronic Packaging

Year:

2009

Language:

english

File:

PDF, 630 KB

english, 2009

27

Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-Architecture

Karajgikar, Saket, Agonafer, Dereje, Ghose, Kanad, Sammakia, Bahgat, Amon, Cristina, Refai-Ahmed, Gamal

Journal:

Journal of Electronic Packaging

Year:

2010

Language:

english

File:

PDF, 671 KB

english, 2010

28

[IEEE 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) - San Jose, CA, USA (2015.3.15-2015.3.19)] 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) - Effect of warm water cooling for an isolated hybrid liquid cooled server

Addagatla, Alekhya, Fernandes, John, Mani, Divya, Agonafer, Dereje, Mulay, Veerendra

Year:

2015

Language:

english

File:

PDF, 1002 KB

english, 2015

29

[ASME ASME 2010 4th International Conference on Energy Sustainability - Phoenix, Arizona, USA (May 17–22, 2010)] ASME 2010 4th International Conference on Energy Sustainability, Volume 2 - Solar Assisted Household Clothes Dryer

Luttrell, Jeff, Agonafer, Dereje

Year:

2010

Language:

english

File:

PDF, 1.38 MB

english, 2010

30

[ASME ASME 2013 International Mechanical Engineering Congress and Exposition - San Diego, California, USA (Friday 15 November 2013)] Volume 8B: Heat Transfer and Thermal Engineering - Application of Phase Change Material in Sustainable Cooling of Data Centers

Dhiman, Nikhil, Shah, Jeet, Agonafer, Dereje, Kannan, Naveen, Hoverson, James, Kaler, Mike

Year:

2013

Language:

english

File:

PDF, 1.81 MB

english, 2013

31

[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems - Combining Computational Fluid Dynamics (CFD) and Flow Network Modeling (FNM) for Design of a Multi-Chip Module (MCM) Cold Plate

Fernandes, John, Ghalambor, Saeed, Docca, Akhil, Aldham, Chris, Agonafer, Dereje, Chenelly, Evan, Chan, Benson, Ellsworth, Michael

Year:

2013

Language:

english

File:

PDF, 1.41 MB

english, 2013

32

[ASME ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, California, USA (Monday 6 July 2015)] Volume 1: Thermal Management - Thermal Modeling of Remote Radio Head Units

Sahini, Manasa, Gebrehiwot, Betsegaw, Agonafer, Dereje, Colapietro, Rocky

Year:

2015

Language:

english

File:

PDF, 3.33 MB

english, 2015

33

[ASME ASME 2005 International Mechanical Engineering Congress and Exposition - Orlando, Florida, USA (November 5 – 11, 2005)] Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology - Design of a Cold Plate Tester for Accurate Measurement of Thermal Performance

Lakhkar, Nikhil, Iyengar, Madhusudan, Ellsworth, Michael, Agonafer, Dereje

Year:

2005

Language:

english

File:

PDF, 297 KB

english, 2005

34

[ASME ASME 2006 International Mechanical Engineering Congress and Exposition - Chicago, Illinois, USA (November 5 – 10, 2006)] Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology - Deformation Characteristics and Constitutive Relationship of SnAgCu Lead (Pb)-Free Solder Alloys Under Thermo-Mechanical and Mechanical Loading

Hossain, Mohammad M., Viswanadham, Puligandla, Agonafer, Dereje, Reinikainen, Tommi

Year:

2006

Language:

english

File:

PDF, 923 KB

english, 2006

35

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature

Bhopte, Siddharth, Agonafer, Dereje, Schmidt, Roger, Sammakia, Bahgat

Year:

2005

Language:

english

File:

PDF, 475 KB

english, 2005

36

Solving Thermal Issues in a Three-Dimensional-Stacked-Quad-Core Processor by Microprocessor Floor Planning, Microchannel Cooling, and Insertion of Through-Silicon-Vias

Chauhan, Anjali, Sammakia, Bahgat, Afram, Furat F., Ghose, Kanad, Refai-Ahmed, Gamal, Agonafer, Dereje

Journal:

Journal of Electronic Packaging

Year:

2013

Language:

english

File:

PDF, 3.59 MB

english, 2013

37

Qualitative Study of Cumulative Corrosion Damage of Information Technology Equipment in a Data Center Utilizing Air-Side Economizer Operating in Recommended and Expanded ASHRAE Envelope

Shah, Jimil M., Awe, Oluwaseun, Gebrehiwot, Betsegaw, Agonafer, Dereje, Singh, Prabjit, Kannan, Naveen, Kaler, Mike

Journal:

Journal of Electronic Packaging

Year:

2017

Language:

english

File:

PDF, 6.53 MB

english, 2017

38

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Impact of PCB Layer Orientation on the Drop Reliability of WCSP Boards

Mahmood, Anik, Barua, Trina, Sakib, A. R. Nazmus, Agonafer, Dereje

Year:

2016

Language:

english

File:

PDF, 595 KB

english, 2016

39

[IEEE 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL (2017.5.30-2017.6.2)] 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Comparative study of high ambient inlet temperature effects on the performance of air vs. liquid cooled IT equipment

Sahini, Manasa, Chowdhury, Uschas, Siddarth, Ashwin, Pradip, Tanmay, Agonafer, Dereje, Zeigham, Roy, Metcalf, Jeff, Branton, Steve

Year:

2017

File:

PDF, 435 KB

2017

40

Thermal Performance and Efficiency of a Mineral Oil Immersed Server Over Varied Environmental Operating Conditions

Eiland, Richard, Edward Fernandes, John, Vallejo, Marianna, Siddarth, Ashwin, Agonafer, Dereje, Mulay, Verrendra

Journal:

Journal of Electronic Packaging

Year:

2017

Language:

english

File:

PDF, 1.99 MB

english, 2017

41

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Effect of Continuous and Discontinuous Fabrication and Reflow Processes on PWB Warpage

Karajgikar, Saket, Ahn, Wonkee, Agonafer, Dereje

Year:

2005

Language:

english

File:

PDF, 319 KB

english, 2005

42

Effectiveness of Rack-Level Fans—Part II: Control Strategies and System Redundancy

Fernandes, John Edward, Eiland, Richard, Nagendran, Bharath, Mulay, Veerendra, Agonafer, Dereje

Journal:

Journal of Electronic Packaging

Year:

2017

Language:

english

File:

PDF, 2.51 MB

english, 2017

43

[ASME ASME 2016 International Mechanical Engineering Congress and Exposition - Phoenix, Arizona, USA (Friday 11 November 2016)] Volume 10: Micro- and Nano-Systems Engineering and Packaging - Qualitative Study of Cumulative Corrosion Damage of IT Equipment in a Data Center Utilizing Air-Side Economizer

Shah, Jimil M., Awe, Oluwaseun, Agarwal, Pavan, Akhigbe, Iziren, Agonafer, Dereje, Singh, Prabjit, Kannan, Naveen, Kaler, Mike

Year:

2016

Language:

english

File:

PDF, 3.07 MB

english, 2016

44

Effectiveness of Rack-Level Fans—Part I: Energy Savings Through Consolidation

Eiland, Richard, Fernandes, John Edward, Nagendran, Bharath, Mulay, Veerendra, Agonafer, Dereje

Journal:

Journal of Electronic Packaging

Year:

2017

Language:

english

File:

PDF, 1.71 MB

english, 2017

45

[IEEE 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL (2017.5.30-2017.6.2)] 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Damage progression study of 3D TSV package during reflow, thermal shocks and thermal cycling

Rahangdale, Unique, Rajmane, Pavan, Doiphode, Aniruddha, Sakib, A. R., Misrak, Abel, Lohia, Alok, Agonafer, Dereje

Year:

2017

Language:

english

File:

PDF, 352 KB

english, 2017

46

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Thermal Based Optimization of Functional Block Distributions in a Non-Uniformly Powered Die

Kaisare, Abhijit, Agonafer, Dereje, Haji-Sheikh, A., Chrysler, Greg, Mahajan, Ravi

Year:

2005

Language:

english

File:

PDF, 497 KB

english, 2005

47

[IEEE 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Experimental Characterization of Vertically Split Distribution Wet- Cooling Media Used in the Direct Evaporative Cooling of Data Centers

Al Khazraji, Ahmed, Siddarth, Ashwin, Varadharasan, Mullaivendhan, Guhe, Abhishek, Agonafer, Dereje, Hoverson, James, Kaler, Mike

Year:

2018

Language:

english

File:

PDF, 2.33 MB

english, 2018

48

Foreword

Sammakia, Bahgat, Agonafer, Dereje

Journal:

Journal of Electronic Packaging

Year:

2004

File:

PDF, 47 KB

2004

49

Prediction of natural convection in horizontal annular enclosures at high Rayleigh numbers

Ashley M Thornhill, E.Kobla Glakpe, Dereje Agonafer

Journal:

International Communications in Heat and Mass Transfer

Year:

1988

Language:

english

File:

PDF, 551 KB

english, 1988

50

Thermo-Mechanical Challenges in Stacked Packaging

Agonafer, Dereje, Kaisare, Abhijit, Hossain, Mohammad M., Lee, Yongje, Dewan-Sandur, Bhavani P., Dishongh, Terry, Pekin, Senol

Journal:

Heat Transfer Engineering

Year:

2008

Language:

english

File:

PDF, 6.25 MB

english, 2008

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